Transient analysis of mode structures and quantification of crosstalk in printed metal strips

被引:0
|
作者
Ahmed, Shahid [1 ]
Linton, David [1 ]
机构
[1] Queens Univ Belfast, Inst Elect Commun & Informat Technol ECIT, Belfast BT3 9DT, Antrim, North Ireland
关键词
UWB; SVD; cross-correlation; TEM; TM;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A detailed analysis of mode structures inside coupled microstrip lines and their correlation with crosstalk between traces has been performed. The use of Finite-Difference Time-Domain and Singular Value Decomposition methods for modal identification followed by cross correlation for crosstalk prediction is demonstrated in this paper. The combination of these methods is robust, versatile and ideal for pulsed applications in an inhomogeneous, anisotropic multi-layer substrate with complex 3D structures. Moreover, all possible modes are extracted in a single analysis. This novel approach provides a quantitative measurement of crosstalk by establishing correlation between modes evolving inside the source line and the field waveforms coupled with the victim line. To our knowledge, this is the first time such a study has been performed. The effects of line topology and pulse characteristics are examined. At the early stage of pulse evolution, the TEM mode of the source line dictates coupling, however, as the pulse advances the higher-order TM mode dominates and exhibits significant contribution to the evolution of the waveform coupled with the victim line which is confirmed by cross-correlation. This study has physical significance in devising systems for suppressing unwanted modes responsible for crosstalk and radiation leakage due to UWB pulses.
引用
收藏
页码:1910 / 1913
页数:4
相关论文
共 50 条
  • [21] Analysis of Crosstalk in High Frequency Printed Circuit Boards in Presence of Via
    Ghosh, Avali
    Das, Sisir Kumar
    Das, Annapurna
    2017 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS (ICEAA), 2017, : 413 - 416
  • [22] Transient analysis of printed circuit board structures using a time domain solution of Kirchoff's network equations
    Railton, CJ
    Ma, LZ
    INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC COMPATIBILITY, 1997, (445): : 113 - 118
  • [23] Crosstalk Analysis of Interconnection Structures Fabricated on Silicon Interposer
    Yi, He
    Cao, Liqiang
    Zhou, Jing
    Wang, Qibing
    Yu, Daquan
    Wan, Lixi
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 547 - 550
  • [24] Transient Analysis of Dispersion Medium with Conducting Strips buried in Different Depth
    Ozaki, Ryosuke
    Yamasaki, Tsuneki
    2021 INTERNATIONAL APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY SYMPOSIUM (ACES), 2021,
  • [25] Linear transient analysis of rectangular laminates using spline finite strips
    Wang, S
    Chen, J
    Dawe, DJ
    COMPOSITE STRUCTURES, 1998, 41 (01) : 57 - 66
  • [26] Kernel-based crosstalk quantification and analysis of a CMOS image sensor
    Mahato, Swaraj Bandhu
    De Ridder, Joris
    Meynants, Guy
    Raskin, Gert
    Van Winckel, Hans
    OPTICAL SENSING AND DETECTION V, 2018, 10680
  • [27] Computationally efficient analysis and design of printed structures
    Alatan, L
    Aksun, MI
    Birand, MT
    IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM - 1996 DIGEST, VOLS 1-3, 1996, : 276 - 279
  • [28] Fast MBF Analysis of Printed FSS Structures
    Jha, Shambhu Nath
    Van Ha, Bui
    Craeye, Christophe
    2015 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING, 2015, : 959 - 960
  • [29] Metal 3D-printed wick structures for heat pipe application: Capillary performance analysis
    Jafari, Davoud
    Wits, Wessel W.
    Geurts, Bernard J.
    APPLIED THERMAL ENGINEERING, 2018, 143 : 403 - 414
  • [30] TRANSIENT STRUCTURES - COMPUTATION, ANALYSIS, AND INTERPRETATION
    MCLEAN, AD
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1985, 190 (SEP): : 110 - PHS