Modelling mutual thermal interactions between power LEDs in SPICE

被引：48
|
作者：
Gorecki, Krzysztof [1 ]
机构：
[1] Gdynia Maritime Univ, Dept Marine Elect, Gdynia, Poland
来源：
MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 02期
关键词：
Power LEDs; Mutual thermal interactions; Modelling; SPICE; ELECTROTHERMAL MODEL; VOLTAGE REGULATORS; PARAMETERS; RESISTANCE;
D O I：
10.1016/j.microrel.2014.11.003
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper concerns modelling an influence of self-heating and mutual thermal coupling on power LEDs characteristics. The electrothermal model of a power LED for SPICE software taking into account electric, thermal and optical properties of the considered devices, and particularly mutual thermal coupling between the devices situated on the common heat-sink, is presented. The method of estimating model parameters values is proposed and the method of measuring their own and mutual thermal resistance between power LEDs is described. Using the elaborated model the characteristics of selected diodes are calculated at different cooling conditions of the investigated LED. The obtained results of calculations are compared with the measurements results for a single diode, two diodes situated on the common heat-sink and a LED module. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码：389 / 395
页数：7
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