A SPICE-based Transient Thermal-Electronic Model for LEDs

被引:3
|
作者
Sun, Bo [1 ]
Fan, Jiajie [2 ]
Fan, Xuejun [3 ]
Zhang, Guoqi [4 ]
机构
[1] Guangdong Univ Technol, Guangzhou, Guangdong, Peoples R China
[2] Hohai Univ, Changzhou, Jiangsu, Peoples R China
[3] Lamar Univ, Beaumont, TX 77710 USA
[4] Delft Univ Technol, Delft, Netherlands
关键词
Electronic Modelling; Thermal-Electronic Simulation; LED; Reliability; Visible Light Communication; VISIBLE-LIGHT COMMUNICATION; OPPORTUNITIES; PREDICTION; SYSTEM; RIPPLE; LAMPS;
D O I
10.1109/eurosime.2019.8724555
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model's temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED's AC behavior. Thermal model and optical model can be integrated with the LED's electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.
引用
收藏
页数:5
相关论文
共 50 条
  • [1] TVS Transient Behavior Characterization and SPICE-Based Behavior Model
    Wei, Pengyu
    Maghlakelidze, Giorgi
    Patnaik, Abhishek
    Gossner, Harald
    Pommerenke, David
    2018 40TH ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM (EOS/ESD), 2018,
  • [2] Team SPICE: A SPICE-Based Teamwork Assessment Model
    Amengual, Esperanca
    Mas, Antonia
    Lluis Mesquida, Antoni
    SYSTEMS, SOFTWARE AND SERVICES PROCESS IMPROVEMENT, 2010, 99 : 37 - 47
  • [3] Design of SPICE-Based Simulation System on Electronic Circuit Experiments
    Yang Yanming
    Zhao Jingcheng
    Li Yuanlei
    ICCSE 2008: PROCEEDINGS OF THE THIRD INTERNATIONAL CONFERENCE ON COMPUTER SCIENCE & EDUCATION: ADVANCED COMPUTER TECHNOLOGY, NEW EDUCATION, 2008, : 1263 - 1266
  • [4] Thermal-Electronic Devices and Thermal-Electronic Logic Circuits (TELC)
    Mizsei, Janos
    Bein, Marton C.
    Juhasz, Laszlo
    Jelinek, Eva
    2015 38TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2015), 2015, : 61 - 65
  • [5] A SPICE-Based Maturity Model for the Governance and Management of Green IT
    David Paton-Romero, J.
    Rodriguez, Moises
    Piattini, Mario
    SOFTWARE PROCESS IMPROVEMENT AND CAPABILITY DETERMINATION, SPICE 2017, 2017, 770 : 143 - 155
  • [6] Characteristics of ferroelectric logic gates using a SPICE-based model
    Macleod, T. C.
    Phillips, T. A.
    Ho, F. D.
    FERROELECTRICS, 2006, 333 : 165 - 175
  • [7] Thermal-Electronic Integrated Logic
    Mizsei, Janos
    Lappalainen, Jyrki
    Bein, Marton C.
    2013 19TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2013, : 344 - 347
  • [8] SPICE-Based Lumped Circuit Model of Shielded Multiconductor Cables
    Raya, Moustafa
    Magdowski, Mathias
    Vick, Ralf
    PROCEEDINGS OF THE 2021 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC 2021), 2021,
  • [9] SPICE-based optoelectronic system simulation
    Neifeld, MA
    Chou, WC
    APPLIED OPTICS, 1998, 37 (26): : 6093 - 6104
  • [10] SPICE-Based Dynamical Model of a NTC Thermoresistive Sensor for Anemometer Applications
    Araujo, L. V.
    Catunda, S. Y. C.
    Belfort, D.
    Denoual, M.
    Freire, R. C. S.
    2015 IEEE INTERNATIONAL INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE (I2MTC), 2015, : 1682 - 1686