Device processing technology for free-space optical interconnect system

被引：0

作者：

Oren, M ^{[1
]}

McCarthy, A ^{[1
]}

Tooley, F ^{[1
]}

Laprise, AE ^{[1
]}

Plant, D ^{[1
]}

Kirk, A ^{[1
]}

Lu, Y ^{[1
]}

Zhao, J ^{[1
]}

机构：

[1] Heriot Watt Univ, Dept Phys, Edinburgh, Midlothian, Scotland

来源：

51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE | 2001年

关键词：

D O I：

10.1109/ECTC.2001.927899

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A device processing technology was developed for fabricating arrays of detectors/modulators chips used in a free-space optical interconnect system. The arrays are fabricated onto a GaAs/AlGaAs multi quantum well (MQW) epitaxial layer having an in-plane anisotropic strain. The packaged module army consists of a strain inducing substrate onto which the GaAs epitaxial layer is transferred, and bonded to a Si CMOS driver by flip chip technology. The module is attached to a printed circuit board(PCB), and two such boards were mounted into a free space optical interconnect demonstration system.

引用

页码：886 / 889

页数：4

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