共 50 条
- [21] Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors 2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
- [23] A thermal aging study on both Au-Cu and Au-Al wire-bonded interlaces 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1761 - 1766
- [24] Ultrasonic bonding: Understanding how process parameters determine the strength of au-al bonds 2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 626 - 631
- [26] Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2023, 59 (22): : 322 - 331
- [27] On the Intermetallic Corrosion of Cu-Al wire bonds 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 585 - 590
- [28] Investigation of the Palladium Distribution in the Intermetallic Phase Region of Au-Al Wire Bond Interconnects 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,