Effect of pyrophosphate ions on the mechanism of discharge-ionization of copper in acid sulfate solutions

被引：1
|
作者：
Lezhava, TI [1 ]
Tsanava, BV [1 ]
Kikabidze, MP [1 ]
机构：
[1] Georgian Acad Sci, Agladze Inst Inorgan Chem & Electrochem, GE-370086 Tbilisi, Georgia
来源：
RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 2003年 / 39卷 / 09期
关键词：
Sodium; Copper; Sulfate; Physical Chemistry; Acid Sulfate;
D O I：
10.1023/A:1025780106057
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The acceleration of the electrodeposition and anodic dissolution of copper in acid sulfate solutions, caused by sodium pyrophosphate, is found to be due to a chemical heterogeneous stage, which involves an adsorbed pyrophosphate ion (probably, H2P2O72-). The assumption about the presence of a surface complex on the surface of copper is substantiated. As follows from adsorption isotherms, obtained for strongly acid (to 2 H2SO4) solutions from anodic Tafel plots, the effect of the acid concentration on the rate of the discharge-ionization of copper is caused by its effect on the surface coverage by the adsorbate. Measurements of the quasi-equilibrium potential of the freshly renewed surface of copper confirm the assumption about the inhibiting of the surface diffusion of adsorbed atoms by adsorbed pyrophosphate.
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页码：973 / 980
页数：8
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