High-resolution 3D X-ray Microscopy for Structural Inspection and Measurement of Semiconductor Package Interconnects

被引：0

作者：

Syahirah, Mohammad-Zulkifli ^{[1
]}

Bernice, Zee ^{[1
]}

Gregorich, Thomas ^{[2
]}

Gu, Allen ^{[2
]}

Yang, YanJing ^{[2
]}

Terada, Masako ^{[2
]}

Lee, Weijie ^{[3
]}

机构：

[1] Adv Micro Devices Singapore Pte Ltd, 508 Chai Chee Lane, Singapore 469032, Singapore

[2] Carl Zeiss SMT Inc, 4385 Hopyard Rd,Suite 100, Pleasanton, CA 94588 USA

[3] Nanyang Technol Univ, Sch Mat Sci & Engn, 11 Fac Ave, Singapore 639977, Singapore

来源：

2019 IEEE 26TH INTERNATIONAL SYMPOSIUM ON PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2019年

关键词：

D O I：

10.1109/ipfa47161.2019.8984854

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

3D X-ray Microscopy (XRM) has become an established failure analysis (FA) tool for bridging fault isolation and physical failure analysis (PFA) because it enables the visualization of defects without destroying the device under test (DUT). Through workflow improvements, it offers the opportunity to improve process characterization and device qualifications. This paper describes the application of new automated scanning and image acquisition capability for repetitive XRM device inspection in defined regions of interest (ROI). Results obtained from two test matrices showed good positioning repeatability meeting accuracy requirements for both small and medium-sized test vehicles with fast acquisition times.

引用

页数：4

共 50 条

[1] 3D X-RAY MICROSCOPY - HIGH-RESOLUTION STEREOIMAGING WITH THE GOTTINGEN X-RAY MICROSCOPE AT BESSY
LEHR, J
ZOOLOGICAL STUDIES, 1995, 34 : 137 - 138
[2] SUBMICRON RESOLUTION 3D X-RAY STRUCTURAL MICROSCOPY
Larson, B. C.
ACTA CRYSTALLOGRAPHICA A-FOUNDATION AND ADVANCES, 2002, 58 : C33 - C33
[3] High resolution 3D x-ray diffraction microscopy
Miao, JW
Ishikawa, T
Johnson, B
Anderson, EH
Lai, B
Hodgson, KO
PHYSICAL REVIEW LETTERS, 2002, 89 (08) : 088303/1 - 088303/4
[4] High-resolution 3D X-ray diffraction microscopy: 3D mapping of deformed metal microstructures
Kutsal, Mustafacan
Poulsen, Henning Friis
Winther, Grethe
Sorensen, Henning Osholm
Detlefs, Carsten
JOURNAL OF APPLIED CRYSTALLOGRAPHY, 2022, 55 (05) : 1125 - 1138
[5] High-resolution 3D grain orientation mapping by inclined scanning 3D X-ray diffraction microscopy
Kim, Jaemyung
Hayashi, Yujiro
Yabashi, Makina
JOURNAL OF APPLIED CRYSTALLOGRAPHY, 2023, 56 : 1416 - 1425
[6] State-of-the-art high-resolution 3d x-ray microscopy for imaging of integrated circuits
Holler, Mirko
Guizar-Sicairos, Manuel
Raabe, Jörg
Holler, Mirko (mirko.holler@psi.ch), 1600, ASM International (23): : 13 - 19
[7] High-resolution compact X-ray microscopy
Takman, P. A. C.
Stollberg, H.
Johansson, G. A.
Holmberg, A.
Lindblom, M.
Hertz, H. M.
JOURNAL OF MICROSCOPY, 2007, 226 (02) : 175 - 181
[8] HIGH-RESOLUTION X-RAY PROJECTION MICROSCOPY
NIXON, WC
PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1955, 232 (1191): : 475 - &
[9] 3D Measurement Workflow for Packaging Development and Production Control Using High-Resolution 3D X-ray Microscope
Gu, Allen
Auyoong, John
2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 206 - 210
[10] High-resolution X-ray inspection for yield improvement
Express Manufacturing Inc., 3519 West Warner Ave., Santa Ana, CA 92704, United States
SMT Surface Mount Technology Magazine, 2001, 15 (02): : 122 - 123

← 1 2 3 4 5 →