Thermal control utilizing an electrohydrodynamic conduction pump in a two-phase loop with high heat flux source

被引:14
|
作者
Jeong, Seong-Il [1 ]
Didion, Jeffrey [2 ]
机构
[1] Korea Adv Inst Sci & Technol, Satellite Technol Res Ctr, Taejon 305701, South Korea
[2] NASA, Goddard Space Flight Ctr, Thermal Technol Dept, Greenbelt, MD 20771 USA
来源
关键词
electrohydrodynamic; conduction pump; thermal control; high heat flux; two-phase;
D O I
10.1115/1.2759971
中图分类号
O414.1 [热力学];
学科分类号
摘要
The electric field applied in dielectric fluids causes an imbalance in the dissociation-recombination reaction generating free space charges. The generated charges are redistributed by the applied electric field, resulting in the heterocharge layers in the vicinity of the electrodes. Proper design of the electrodes generates net axial flow motion pumping the fluid. The electrohydrodynamic (EHD) conduction pump is a new device that pumps dielectric fluids utilizing heterocharge layers formed by imposition of electrostatic fields. This paper experimentally evaluates the performance of a two-phase (liquid-vapor) breadboard thermal control loop consisting of an EHD conduction pump, condenser, preheater evaporator transport lines, and reservoir (accumulator). This study is performed to address the feasibility of the EHD two-phase loop for thermal control of a laser equipment with high heat flux source. The generated pressure head and the maximum applicable heat flux are experimentally determined at various applied voltages and sink temperatures. Recovery from the evaporator dryout condition by increasing the applied voltage to the pump is also demonstrated. The performance of the EHD conduction pump in this study confirms that the EHD conduction pump can be used as a stand-alone system for high heat flux thermal control.
引用
收藏
页码:1576 / 1583
页数:8
相关论文
共 50 条
  • [21] Design and simulation of two-phase thermal control system for space high power source
    Liu Qingzhi
    Yang Changpeng
    Xu Kan
    Zhao Xin
    CHINESE SPACE SCIENCE AND TECHNOLOGY, 2023, 43 (04) : 104 - 110
  • [22] Application of electrohydrodynamic atomization to two-phase impingement heat transfer
    Feng, Xin
    Bryan, James E.
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2008, 130 (07):
  • [23] Experimental study on the thermal performance of a novel two-phase loop thermosyphon under low-heat-flux conditions
    Wang, Lin
    Zhong, Wei
    Min, Wandong
    Wang, Zijin
    Cao, Xiaoling
    APPLIED THERMAL ENGINEERING, 2024, 236
  • [24] RECENT ADVANCES IN HIGH-FLUX, TWO-PHASE THERMAL MANAGEMENT
    Mudawar, Issam
    PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE - 2013, VOL 2, 2014,
  • [25] Recent Advances in High-Flux, Two-Phase Thermal Management
    Mudawar, Issam
    JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS, 2013, 5 (02)
  • [26] Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks
    Qu, WL
    Mudawar, I
    ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 347 - 359
  • [27] Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks
    Qu, WL
    Mudawar, I
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (03): : 598 - 609
  • [28] SINGLE- AND TWO-PHASE FLOW IN MICROCHANNELS WITH HEAT TRANSFER AND DRIVEN BY AN EHD CONDUCTION PUMP
    Pearson, Matthew R.
    Seyed-Yagoobi, Jamal
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 10, PTS A AND B, 2012, : 937 - 952
  • [29] MATHEMATICAL MODELS OF HEAT CONDUCTION WITH A TWO-PHASE LAG
    Kartashov, E. M.
    JOURNAL OF ENGINEERING PHYSICS AND THERMOPHYSICS, 2016, 89 (02) : 346 - 356
  • [30] DIRECT-TO-CHIP TWO-PHASE COOLING FOR HIGH HEAT FLUX PROCESSORS
    Heydari, Ali
    Manaserh, Yaman
    Abubakar, Ahmad
    Caceres, Carol
    Miyamura, Harold
    Ortega, Alfonso
    Rodriguez, Jeremy
    PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022, 2022,