Diffusion bonding of boron nitride on metal substrates by plasma activated sintering (PAS) process

被引:13
|
作者
Yoo, S
Groza, JR
Sudarshan, TS
Yamazaki, K
机构
[1] UNIV CALIF DAVIS,DEPT MECH ENGN,DAVIS,CA 95616
[2] MAT MODIFICAT INC,FAIRFAX,VA 22301
关键词
D O I
10.1016/1359-6462(96)00008-5
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
[No abstract available]
引用
收藏
页码:1383 / 1386
页数:4
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