Convective Heat Transfer in Graphite Foam Heat Sinks With Baffle and Stagger Structures

被引:14
|
作者
Leong, K. C. [1 ]
Li, H. Y. [1 ]
Jin, L. W. [1 ]
Chai, J. C. [2 ]
机构
[1] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore 639798, Singapore
[2] Petr Inst, Dept Mech Engn, Abu Dhabi, U Arab Emirates
来源
关键词
forced convection; graphite foam; Nusselt number; porous medium; pressure drop; POROUS CARBON FOAM; THERMAL MANAGEMENT; FLOW;
D O I
10.1115/1.4003449
中图分类号
O414.1 [热力学];
学科分类号
摘要
Highly conductive porous media have recently been considered for enhanced cooling applications due to their large internal contact surface area, which promotes convection at the pore level. In this paper, graphite foams that possess high thermal conductivity but low permeability are investigated for convection heat transfer enhancement using air as coolant. Two novel heat sink structures are designed to reduce the fluid pressure drop. Both experimental and numerical approaches are adopted in the study. The experimental data show that the designed structures significantly reduce flow resistance in graphite foams while maintaining relatively good heat removal performance. The numerical results obtained based on the local thermal nonequilibrium model are validated by experimental data and show that the inlet air flow partially penetrates the structured foam walls, while the remaining air flows tortuously through slots in the structure. Flow mixing, which is absent in the block graphite foam, is observed in the freestream area inside the designed structure. It can be concluded that graphite foams with appropriately designed structures can be applied as air-cooled heat sinks in thermal management applications. [DOI: 10.1115/1.4003449]
引用
收藏
页数:9
相关论文
共 50 条
  • [41] Quantification of convective heat transfer inside tree structures
    Collin, Anthony
    Lamorlette, Aymeric
    6TH EUROPEAN THERMAL SCIENCES CONFERENCE (EUROTHERM 2012), 2012, 395
  • [42] Convective heat transfer in tortuous heat radiator filled with open-cell copper foam
    Thermal Science and Energy Engineering, University of Science and Technology of China, Hefei 230027, China
    Kung Cheng Je Wu Li Hsueh Pao, 2009, 11 (1936-1938):
  • [43] Flow and heat transfer performances of helical baffle heat exchangers with different baffle configurations
    Dong, Cong
    Chen, Ya-Ping
    Wu, Jia-Feng
    APPLIED THERMAL ENGINEERING, 2015, 80 : 328 - 338
  • [44] Computational analysis of nanofluid effects on convective heat transfer enhancement of micro-pin-fin heat sinks
    Seyf, Hamid Reza
    Feizbakhshi, Morteza
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2012, 58 : 168 - 179
  • [45] Forced convective heat transfer performance of foam-like structures - comparison of the Weaire-Phelan and the Kelvin structures with real metal foam
    Zhang, Zhaoda
    Yan, Guanghan
    Sun, Mingrui
    Li, Shuai
    Zhang, Xiaokai
    Song, Yongchen
    Liu, Yu
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2024, 227
  • [46] Numerical and Experimental Study on Convective Heat Transfer Characteristics in Foam Materials
    Lu, Hongyan
    Yang, Lixin
    Wu, Zhiyong
    Xu, Siqi
    ENERGIES, 2020, 13 (02)
  • [47] Influence of Different Baffle Structures on Heat Transfer Performance of Shell and Tube Heat Exchanger for Seawater Source Heat Pump
    Zhang, Guanzheng
    Li, Baohua
    Dai, YuanJun
    2022 IEEE 13TH INTERNATIONAL CONFERENCE ON MECHANICAL AND INTELLIGENT MANUFACTURING TECHNOLOGIES (ICMIMT 2022), 2022, : 221 - 225
  • [48] A computer model to simulate heat transfer in heat sinks
    Visser, JA
    Gauche, P
    ADVANCED COMPUTATIONAL METHODS IN HEAT TRANSFER IV, 1996, : 569 - 578
  • [49] Effects of different geometric structures on fluid flow and heat transfer performance in microchannel heat sinks
    Xia, G. D.
    Jiang, J.
    Wang, J.
    Zhai, Y. L.
    Ma, D. D.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2015, 80 : 439 - 447
  • [50] Heat Transfer and Pressure Drop Characteristics of Finned Metal Foam Heat Sinks Under Uniform Impinging Flow
    Feng, S. S.
    Kuang, J. J.
    Lu, T. J.
    Ichimiya, K.
    JOURNAL OF ELECTRONIC PACKAGING, 2015, 137 (02)