ATTAINING SINGLE-CHIP, HIGH-PERFORMANCE COMPUTING THROUGH 3D SYSTEMS WITH ACTIVE COOLING

被引：10

作者：

Coskun, Ayse K. ^{[1
]}

Meng, Jie

Atienza, David ^{[2
]}

Sabry, Mohamed M. ^{[2
,3
]}

机构：

[1] Boston Univ, Dept Elect & Comp Engn, Boston, MA 02215 USA

[2] Ecole Polytech Fed Lausanne, Embedded Syst Lab, CH-1015 Lausanne, Switzerland

[3] Ecole Polytech Fed Lausanne, Dept Elect Engn, CH-1015 Lausanne, Switzerland

来源：

IEEE MICRO | 2011年 / 31卷 / 04期

关键词：

3D liquid-cooled systems; active cooling; emerging technologies; energy-aware systems; multiprocessor systems; temperature-aware design;

D O I：

10.1109/MM.2011.39

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This article explores the benefits and the challenges of 3d design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3d liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.

引用

页码：63 / 73

页数：11

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