Characterization of moisture properties of polymers for IC packaging

被引：11
|
作者：
Ma, Xiaosong
Jansen, K. M. B.
Ernst, L. J.
van Driel, W. D.
van der Sluis, O.
Zhang, G. Q.
机构：
[1] Delft Univ Technol, NL-2628 CD Delft, Netherlands
[2] NXP, NL-6534 AE Nijmegen, Netherlands
[3] Philips Appl Technol, NL-5656 AE Eindhoven, Netherlands
来源：
MICROELECTRONICS RELIABILITY | 2007年 / 47卷 / 9-11期
关键词：
D O I：
10.1016/j.microrel.2007.07.090
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper we determined the water uptake of a die attach and a molding compound. The two types of polymer which were selected are a die attach filled with silver particles and an epoxy molding compound filled with silica particles. The water absorption is carried out in an adjustable thermal and humidity chamber, SGA-100, at different temperatures and humidity levels. Moisture absorption equilibrium of test data were obtained by experiment. The moisture absorption equilibrium prediction equation was modeled by using the extrapolated experimental data. Diffusion coefficients at different temperature were obtained from the moisture absorption experiments. (C) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1685 / 1689
页数：5
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