On the road to reliable MEMS

被引：0

作者：

Gasparyan, A ^{[1
]}

Shea, H ^{[1
]}

Arney, S ^{[1
]}

Aksyuk, V ^{[1
]}

Simon, ME ^{[1
]}

Pardo, F ^{[1
]}

Chan, HB ^{[1
]}

Kim, J ^{[1
]}

Gates, J ^{[1
]}

Goyal, S ^{[1
]}

Kleiman, R ^{[1
]}

机构：

[1] Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA

来源：

2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2003年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Dielectric charging,. mechanical creep and fatigue of materials, stresses in thin films, sensitivity to mechanical vibrations and shock is but a partial list of issues that may arise on the road to reliable MEMS. Major electrical and mechanical phenomenon that may limit the lifetime or functionality of MEMS devices will be discussed along with the design rules, materials choices and reliability vs. functionality tradeoffs that are required for, designing MEMS for high performance and reliability.

引用

页码：626 / 627

页数：2

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