Lithography challenges for leading edge 3D packaging applications

被引：0
|
作者：
Flack, Warren W. [1 ]
Ranjan, Manish [1 ]
Kenyon, Ganeth
Hsieh, Robert
Slabbekoorn, John [2 ]
Miller, Andy [2 ]
机构：
[1] Ultratech Inc, Adv Packaging & Nanotechnol Markets, San Jose, CA 95124 USA
[2] IMEC, Louvain, Belgium
来源：
SOLID STATE TECHNOLOGY | 2012年 / 55卷 / 04期
关键词：
5;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：29 / 32
页数：4
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