Hot chips 18

被引：0
|
作者：
Kubiatowicz, John
Sachs, Howard
机构：
[1] University of California, Berkeley, Department of Electrical Engineering and Computer Science, Computer Science Division, 673 Soda Hall, Berkeley, CA 94720-1776, United States
[2] Telairity, 3375 Scott Blvd., Santa Clara, CA 95054, United States
来源：
IEEE MICRO | 2007年 / 27卷 / 02期
关键词：
D O I：
10.1109/MM.2007.33
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：7 / 9
页数：3
相关论文
共 50 条
  • [31] Keeping hot chips cool
    Puri, R
    Stok, L
    Bhattacharya, S
    42nd Design Automation Conference, Proceedings 2005, 2005, : 285 - 288
  • [32] HOT CHIPS TURNS 20
    Kozyrakis, Christos
    van de Waerdt, Jan-Willem
    IEEE MICRO, 2009, 29 (02) : 4 - 5
  • [33] HOT CHIPS 21 Introduction
    Asanovic, Krste
    Wittig, Ralph
    IEEE MICRO, 2010, 30 (02) : 5 - 6
  • [34] Hot Chips: Stacking Tutorial
    Lee, Choon
    2012 IEEE HOT CHIPS 24 SYMPOSIUM (HCS), 2012,
  • [35] Hot chips and soggy software
    Johnson, Stephen C., 1600, (10):
  • [36] Visiting Hot Chips IX
    Mateosian, RM
    IEEE MICRO, 1997, 17 (05) : 5 - 5
  • [37] From Cool Chips to Hot Interconnects
    Eeckhout, Lieven
    IEEE MICRO, 2017, 37 (05) : 4 - 5
  • [38] Hot technology produces cool chips
    Edwards, John
    Electronic Design, 2007, 55 (02)
  • [39] Recycling of Aluminum Chips by Hot Extrusion
    Haase, Matthias
    Jaeger, Andreas
    Tekkaya, A. Erman
    NEW PRODUCTION TECHNOLOGIES IN AEROSPACE INDUSTRY, 2013, : 197 - 201
  • [40] Bubbles chill out hot chips
    不详
    INTECH, 2003, 50 (06) : 14 - 14
12345