Enhancement of Gate-Bias and Current Stress Stability of P-Type SnO Thin-Film Transistors with SiNx/HfO2 Passivation Layers

被引:0
|
作者
Hsu, Shu-Ming [1 ]
Li, Yun-Shivan [1 ]
Tu, Min-Sheng [1 ]
He, Jyun-Ci [1 ]
Chiu, I-Chung [1 ]
Chen, Pin-Guang [2 ,3 ]
Lee, Min-Hung [3 ]
Chen, Jian-Zhang [4 ]
Cheng, I-Chun [1 ]
机构
[1] Natl Taiwan Univ, Grad Inst Photon & Optoelect, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[2] Natl Taiwan Univ, Dept Mech Engn, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[3] Natl Taiwan Normal Univ, Inst Electroopt Sci & Technol, 88,Sec 4,Ting Chou Rd, Taipei 11677, Taiwan
[4] Natl Taiwan Univ, Inst Appl Mech, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
关键词
ROOM-TEMPERATURE; DEPENDENCE; MOBILITY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, we report enhanced gate-bias and current stress stability of p-type SnO thin-film transistors passivated with SiNx/HfO2 layers. The improvement is primarily attributed to the effective suppression of bias-induced adsorption of oxygen molecules on the back-channel surface by the presence of passivation layers. Under the gate-bias stress of 10 V and -10 V for 10000 s, the threshold voltage shifts for the passivated TFT are 0.75 V and -0.42 V, respectively, while the corresponding values for the unpassivated one are 1.24 V and -0.77 V. Under the current stress of 2.5 mu A for 10000 s, the threshold voltage shift is -0.29 V for the passivated TFT and -0.63 V for the unpassivated one.
引用
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页码:153 / 156
页数:4
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