Silver (Ag) nanosheet-coated Cu nanowires (denoted as Cu@AgNWs) were prepared with a facile transmetalation reaction method. The effect of reaction conditions on the morphology and microstructure of the as-prepared Cu@AgNWs was investigated, and the thermal stability of Cu@AgNWs was evaluated by thermogravimetric analysis. In the meantime, the asprepared Cu@AgNWs were used as the nanofillers of epoxy resin (EP), and their effect on the electrical conductivity and wear resistance of the EP-matrix composites was examined. Results indicate that the as-prepared Cu@AgNWs consist of CuNW core and Ag nanosheet shell. The Ag nanosheet shell can well inhibit the oxidation of the CuNW core, thereby providing the asprepared Cu@AgNWs with good thermal stability even at an elevated temperature of 230 degrees C. The reaction temperature, Cu/Ag molar ratio, Cu dispersion concentration, and the dropping speed of silver ammonia reagent are suggested to be 40 degrees C, 5: 1, 1% (mass fraction), and poured directly, respectively. Resultant Cu@AgNWs exhibit desired morphology and performance and can effectively increase the electrical conductivity and wear resistance of EP. This could make it feasible for the Cu@AgNW-EP composite to be applied as an electrostatic conductive material.