PCB-level Electro thermal Coupling Simulation Analysis

被引：1
|
作者：
Zhou, Runjing [1 ]
Shao, Xuchen [1 ]
机构：
[1] Inner Mongolia Univ Hohhot, Coll Elect Informat, Hohhot, Peoples R China
来源：
INTERNATIONAL CONFERENCE ON FLUID MECHANICS AND INDUSTRIAL APPLICATIONS (FMIA 2017) | 2017年 / 916卷
关键词：
Electro thermal coupling; Joule heat; Voltage distribution; Thermal distribution;
D O I：
10.1088/1742-6596/916/1/012054
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
Power transmission network needs to transmit more current with the increase of the power density. The problem of temperature rise and the reliability is becoming more and more serious. In order to accurately design the power supply system, we must consider the influence of the power supply system including Joule heat, air convection and other factors. Therefore, this paper analyzes the relationship between the electric circuit and the thermal circuit on the basis of the theory of electric circuit and thermal circuit.
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收藏
页数：8
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