MicroDAC strain measurement for FEA support

The paper gives an overview on the application of strain measurement by pattern correlation techniques to support finite element analysis (FEA) for electronics packaging. The utilized microDAC tools are briefly introduced. Main application fields in connection with FEA are the validation of finite element mechanical modeling by comparison of selected simulated and measured strain fields, as well as the determination of material properties. Geometrical modeling can be also supported by detecting defect sites, which have to be included in FEA models. Finally, strain field measurements on real components generally allow to figure out weak points of mechanical modeling, e.g. unacceptable simplification. Measurement examples are presented with regard to investigations on electrical interconnect reliability in flip chip technology.