Special issue on solder geometry - Foreword

被引：1
|
作者：
Heinrich, SM
机构：
来源：
JOURNAL OF ELECTRONIC PACKAGING | 1996年 / 118卷 / 03期
关键词：
D O I：
10.1115/1.2792139
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：113 / 113
页数：1
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