Electrodeposition and characterization of Cu-Nb composite coatings

被引：8

作者：

Robin, Alain ^{[1
]}

Rosa, Jorge Luiz ^{[1
]}

Silva, Messias Borges ^{[2
]}

机构：

[1] Univ Sao Paulo, Escola Engn Lorena, Dept Mat Engn, BR-12600000 Lorena, SP, Brazil

[2] Univ Sao Paulo, Escola Engn Lorena, Dept Engn Quim, BR-12600000 Lorena, SP, Brazil

来源：

SURFACE & COATINGS TECHNOLOGY | 2010年 / 205卷 / 07期

关键词：

Copper; Niobium; Electrocomposites; Design of experiments; Characterization; ALUMINA PARTICLES; INERT PARTICLES; COPPER; MATRIX; CORROSION; CODEPOSITION; INHIBITION; DEPOSITION; FILMS;

D O I：

10.1016/j.surfcoat.2010.08.124

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Copper coatings containing well-distributed Nb particles were obtained by co-electrodeposition in an acidic sulfate bath. Nb particle concentration in the bath was the most significant factor for the incorporation of Nb particles in copper, followed by stirring rate, whereas current density presented low significance. High Nb particle concentration and low stirring rate led to a higher incorporated Nb particle content. The microhardness of the composite layers was higher than that of pure copper deposits obtained under the same conditions due to copper matrix grain refinement and increased with the increase of both current density and incorporated Nb particle volume fraction. The corrosion resistance of Cu-Nb composites in 0.5 wt.% H(2)SO(4) solution at room temperature was higher than that of pure copper and increased with the increase of the Nb content. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：2152 / 2159

页数：8

共 50 条

[21] Effect of fabrication mode on microstructure, texture and strength in Cu-Nb/Ti composite
FAMU-FSU Coll of Engineering, Tallahassee, United States
Scripta Mater, 1 (27-33):
[22] Low-temperature relaxation processes in a Cu-Nb nanostructured fiber composite
Vatazhuk, E. N.
Pal-Val, P. P.
Pal-Val, L. N.
Natsik, V. D.
Tikhonovsky, M. A.
Kupriyanov, A. A.
LOW TEMPERATURE PHYSICS, 2009, 35 (05) : 417 - 423
[23] MONOTECTIC REACTION IN CU-NB ALLOYS
VERHOEVEN, JD
GIBSON, ED
JOURNAL OF MATERIALS SCIENCE, 1978, 13 (07) : 1576 - 1582
[24] The effect of fabrication mode on microstructure, texture and strength in Cu-Nb/Ti composite
Brandao, L
Kalu, PN
SCRIPTA MATERIALIA, 1998, 39 (01) : 27 - 33
[25] OBSERVATION OF NB FILAMENTS IN CU-NB INSITU COMPOSITES
CHUMBLEY, LS
LAABS, FC
SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (09): : 2097 - 2101
[26] OXIDATION BEHAVIOR OF CU-NB MICROCOMPOSITES
CHIANG, KT
KALLENBORN, KJ
YUEN, JL
PATON, NE
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1992, 156 (01): : 85 - 90
[27] Vacancies at the Cu-Nb semicoherent interface
Metsanurk, E.
Tamm, A.
Aabloo, A.
Klintenberg, M.
Caro, A.
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2017, 25 (02)
[28] Formation of the microstructure in Cu-Nb alloys
Freudenberger, J
Botcharova, E
Schultz, L
JOURNAL OF MATERIALS SCIENCE, 2004, 39 (16-17) : 5343 - 5345
[29] Multiscale modeling of the elastic behavior of architectured and nanostructured Cu-Nb composite wires
Gu, T.
Castelnau, O.
Forest, S.
Herve-Luanco, E.
Lecouturier, F.
Proudhon, H.
Thilly, L.
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2017, 121 : 148 - 162
[30] Low cost drilled billet production method for Cu-Nb composite wire
Kalu, PN
Van Sciver, S
Brandao, L
Azeredo, V
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2000, 10 (01) : 1288 - 1291

← 1 2 3 4 5 →