Determination of an optimum geometrical arrangement of workpiece in the ultrasonic elliptic-vibration shoe centerless grinding

被引:9
|
作者
Wu, Y
Fan, Y
Kato, M
Tachibana, T
Syoji, K
Kuriyagawa, T
机构
[1] Akita Prefectural Univ, Akita 0150055, Japan
[2] Micron Machinery Co Ltd, Ymagata 9902303, Japan
[3] Tohoku Univ, Aoba Ku, Sendai, Miyagi 9808579, Japan
来源
关键词
centerless grinding; regulating wheel; ultrasonic vibration; PZT; shoe; machine tools; grinding conditions; roundness;
D O I
10.4028/www.scientific.net/KEM.257-258.495
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This paper clarifies the influence of the geometrical arrangement of the workpiece on workpiece roundness in the ultrasonic elliptic-vibration shoe centerless grinding, and determines an optimum geometrical arrangement for minimizing the roundness error of the workpiece. The influence of the geometrical arrangements (alpha, beta, phi) of the workpiece on workpiece roundness were investigated by computer simulation involving a cylindrical workpiece of 5 mm in diameter with an initial roundness error of 25 mu m. The results indicated that the final roundness error of the workpiece after grinding reaches a minimum at alpha+beta=7 degrees for various values of phi. It was found that the smaller the blade angle 0, the more precise the workpiece in terms of final roundness. Practical grinding operations involving pin shaped workpieces, such as SKH51, 5 mm in diameter and 15 mm in length, were carried out on the experimental apparatus previously developed. The experimental results agreed closely with those obtained by the simulation, showing that the optimum geometrical arrangement of the workpiece can be determined at alpha+beta=7 degrees and phi=60 degrees, in which the workpiece roundness was improved from an initial roundness error of 25 mu m to the final one of approximately 0.6 mu m.
引用
收藏
页码:495 / 500
页数:6
相关论文
共 32 条
  • [21] Modeling of material-removal in workpiece lateral ultrasonic vibration grinding of fine-crystalline zirconia ceramics
    Wu, Y.
    Zhao, B.
    Zhu, X. S.
    ADVANCES IN MACHINING & MANUFACTURING TECHNOLOGY VIII, 2006, 315-316 : 304 - 308
  • [22] Characteristics of chip generation by vertical elliptic ultrasonic vibration-assisted grinding of brittle materials
    Y. Peng
    Z. Liang
    Y. Wu
    Y. Guo
    C. Wang
    The International Journal of Advanced Manufacturing Technology, 2012, 62 : 563 - 568
  • [23] Characteristics of chip generation by vertical elliptic ultrasonic vibration-assisted grinding of brittle materials
    Peng, Y.
    Liang, Z.
    Wu, Y.
    Guo, Y.
    Wang, C.
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2012, 62 (5-8): : 563 - 568
  • [24] Experimental Study on the Dressing Force of Super-abrasive Grinding Wheel with Elliptic Ultrasonic Vibration
    Zhao, Bo
    Gao, Guofu
    Kong, Qinghua
    ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV, 2009, 416 : 578 - +
  • [25] Research on Grinding Temperature of Nano ZrO2 Ceramics Using Diamond Grinding Wheel Dressed by Elliptic Ultrasonic Vibration
    Xue, Jinxue
    Zhao, Bo
    HISTORY OF MECHANICAL TECHNOLOGY AND MECHANICAL DESIGN, 2011, 42 : 313 - +
  • [26] Investigations on the micro-interactions of grit-workpiece and forces prediction in ultrasonic vibration side grinding of optical glass
    Huang, Cheng
    Zhou, Ming
    Zhang, Haijun
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2022, 300
  • [27] Prediction and Experimental Verification of Workpiece Surface Topology in Axial Ultrasonic Vibration Assisted Grinding Based on Dynamic Profile Sampling Method
    Wang Y.
    Li D.
    Liu J.
    Song H.
    Peng S.
    Wang R.
    Wang, Yan (yanwang909909@163.com), 2018, Chinese Mechanical Engineering Society (54): : 221 - 230
  • [28] Optimum design of rotary non-contact electric power transmission device for Ultrasonic Vibration Internal Grinding System
    Yin, Zhen
    Li, Hua
    Li, Yan
    Xie, Ou
    Li, Zheng
    ADVANCES IN MECHATRONICS TECHNOLOGY, 2011, 43 : 293 - +
  • [29] Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain
    Zhang, Kun
    Yin, Zhen
    Dai, Chenwei
    Miao, Qing
    Zhang, Peng
    Cao, Ziyang
    CERAMICS INTERNATIONAL, 2023, 49 (06) : 10041 - 10055
  • [30] Analytical modeling of abrasive grain-workpiece cutting coefficient and experimental investigation on tangential ultrasonic vibration-assisted forming grinding gear
    Wenbo Bie
    Bo Zhao
    Guofu Gao
    Fan Chen
    Shaopeng Chen
    The International Journal of Advanced Manufacturing Technology, 2023, 125 : 299 - 317