Bonding, exposing and transferring technique in SU-8 and SU-8 laser micromachining combination for 3D, free-standing and multilevel microstructures

被引:1
|
作者
Medina, D. [1 ]
Perdigones, F. [1 ]
Garcia, J. [1 ]
Luque, A. [1 ]
Quero, J. M. [1 ]
机构
[1] Univ Seville, Dept Ingn Elect, Escuela Super Ingn, Seville, Spain
来源
MICRO & NANO LETTERS | 2012年 / 7卷 / 05期
关键词
INTERFERENCE LITHOGRAPHY; EMBEDDED MICROCHANNELS; MICROFLUIDIC DEVICES; NEGATIVE RESIST; FABRICATION; MEMS;
D O I
10.1049/mnl.2012.0124
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This Letter reports a simple laser process to fabricate three-dimensional, free-standing and multilevel polymeric (SU-8) microstructures using a nanoseconds neodymium-doped yttrium aluminium garnet (Nd:YAG) laser. The proposed process is intended to be a complement for the bonding, exposing and transferring technique in SU-8 (BETTS) process in MEMS applications. Thanks to this technique, BETTS-laser micromachining, the fabrication of free-standing 3D SU-8 microstructures can be performed, decreasing the number of steps of the typical SU-8 process. Furthermore, it improves the aspect ratio of BETTS-based planar microstructures, and also allows the fabrication of 3D microstructures which are not possible to fabricate using BETTS, or the typical SU-8 process. To prove the viability of BETTS-laser micromachining process, several microstructures have successfully been fabricated.
引用
收藏
页码:412 / 414
页数:3
相关论文
共 50 条
  • [31] SU-8 3D microoptic components fabricated by inclined UV lithography in water
    Ling, Z.
    Lian, K.
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2007, 13 (3-4): : 245 - 251
  • [32] SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
    del Campo, A.
    Greiner, C.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (06) : R81 - R95
  • [33] Fabrication of 3D SU-8 Photoresist Microarrays via Inclined Uitraviolet Lithography
    Li Gang
    Li Da-Wei
    Zhao Qing-Hua
    Jian Ao-Qun
    Wang Kai-Ying
    Hu Jie
    Sang Sheng-Bo
    Cheng Zai-Jun
    Sun-Wei
    CHINESE JOURNAL OF ANALYTICAL CHEMISTRY, 2016, 44 (04) : 660 - 664
  • [34] Fabrication of SU-8 multilayer microstructures based on successive CMOS compatible adhesive bonding and releasing steps
    Agirregabiria, M
    Blanco, FJ
    Berganzo, J
    Arroyo, MT
    Fullaondo, A
    Mayora, K
    Ruano-López, JM
    LAB ON A CHIP, 2005, 5 (05) : 545 - 552
  • [35] Influence of baking conditions on 3D microstructures by direct laser writing in negative photoresist SU-8 via two-photon polymerization
    Tsutsumi, Naoto
    Sakamoto, Nanaho
    Nakamura, Ryotaro
    Kinashi, Kenji
    Sakai, Wataru
    JOURNAL OF LASER APPLICATIONS, 2017, 29 (04)
  • [36] Off-wafer fabrication and surface modification of asymmetric 3D SU-8 microparticles
    Tao, Sarah L.
    Popat, Ketul
    Desai, Tejal A.
    NATURE PROTOCOLS, 2006, 1 (06) : 3153 - 3158
  • [37] Off-wafer fabrication and surface modification of asymmetric 3D SU-8 microparticles
    Sarah L Tao
    Ketul Popat
    Tejal A Desai
    Nature Protocols, 2006, 1 : 3153 - 3158
  • [38] Investigations of SU-8 removal from metallic high aspect ratio microstructures with a novel plasma technique
    Rainer Engelke
    Josef Mathuni
    Gisela Ahrens
    Gabi Gruetzner
    Martin Bednarzik
    Daniel Schondelmaier
    Bernd Loechel
    Microsystem Technologies, 2008, 14 : 1607 - 1612
  • [39] SU-8 based microdevices to study self-induced chemotaxis in 3D microenvironments
    Ayuso, Jose Maria
    Mongel, Rosa
    Llamazares, Guillermo A.
    Moreno, Marco
    Agirregabiria, Maria
    Bergamo, Javier
    Doblare, Manuel
    Ochoa, Lnaki
    Fernandez, Luis J.
    FRONTIERS IN MATERIALS, 2015, 2
  • [40] Bimetallic thin film grayscale photomasks for complex 3D microstructure creation in SU-8
    Wang, Jun
    Dykes, James M.
    Choo, Chinheng
    Poon, David K.
    Chang, Marian
    Tsui, Jimmy T. K.
    Chapman, Glenn H.
    2007 CANADIAN CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING, VOLS 1-3, 2007, : 959 - 962