Thin-film silicon-on-sapphire LDMOS structures for RF power amplifier applications

This work is addressed to the investigation of the electro-thermal performance of RF-LDMOS transistors integrated in TF-SOI, TF-SOS and thinned TF-SOS substrates by means of numerical simulations. Reported experimental trap density, carrier mobility and capture crosssection values have been used together with sapphire datasheet thermal properties, in order to provide accurate simulation results. It is found that subthreshold characteristics are the same for all the analysed substrates while blocking-state, on-state and power dissipation process depends on the substrate type. (C) 2003 Elsevier Ltd. All rights reserved.