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- [42] Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 463 - +
- [45] Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles Journal of Materials Science: Materials in Electronics, 2019, 30 : 15054 - 15063
- [46] Knowledge-based Reliability Qualification and an Acceleration Model for Lead-free Solder Joint 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1291 - 1295
- [47] An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 139 - +
- [49] Reliability Analysis of Lead-free Solders WCECS 2008: WORLD CONGRESS ON ENGINEERING AND COMPUTER SCIENCE, 2008, : 397 - 401
- [50] Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections Journal of Materials Research, 2004, 19 : 3214 - 3223