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- [1] Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1375 - +
- [2] Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (02): : 302 - 308
- [3] Gapless Rework and Reliability of Lead-Free BGA Assemblies 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1259 - 1264
- [4] Rework and reliability of QFP and BGA lead-free assemblies PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 194 - 199
- [5] Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 275 - +
- [6] The indentation size effect in SnAgCu lead-free BGA solder joints at elevated temperatures 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [7] Electromigration Failure of SnAgCu Lead-free BGA Package Assembled with SnPb Solder Paste 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 892 - 895