Two dimensional profiling of ultra-shallow implants using SIMS

被引:0
|
作者
Cooke, GA [1 ]
Gibbons, R [1 ]
Dowsett, MG [1 ]
机构
[1] Univ Warwick, Dept Phys, Coventry CV4 7AL, W Midlands, England
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The lateral spread of dopant under the implant mask edge and its behaviour during thermal processing is becoming increasingly important as device dimensions are reduced. Direct measurement of the distribution by high spatial resolution SIMS is not possible owing to the very few impurity atoms present in the analyte volume at junction concentrations. In this paper we describe a SIMS based technique, using a special sample structure, that may be used to access this information and discuss the instrumental requirements, resolution and detection limits, as well as presenting cross sectional dopant data.
引用
收藏
页码:766 / 770
页数:5
相关论文
共 50 条
  • [31] Defect Engineering for Ultra-Shallow Junctions Using Surfaces
    Seebauer, E. G.
    Kwok, C. T. M.
    Vaidyanathan, R.
    Kondratenko, Y. V.
    Yeong, S. H.
    Srinivasan, M. P.
    Colombeau, Benjamin
    Chan, Lap
    [J]. ION IMPLANTATION TECHNOLOGY 2008, 2008, 1066 : 34 - +
  • [32] Ultra-shallow depth profiling of arsenic implants in silicon by hydride generation-inductively coupled plasma atomic emission spectrometry
    Matsubara, Atsuko
    Kojima, Hisao
    Itoga, Toshihiko
    Kanehori, Keiichi
    [J]. Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1995, 34 (8 A): : 3965 - 3969
  • [33] C-V profiling of ultra-shallow junctions using step-like background profiles
    Popadic, Milos
    Milovanovic, Vladimir
    Xu, Cuiqin
    Sarubbi, Francesco
    Nanver, Lis K.
    [J]. SOLID-STATE ELECTRONICS, 2010, 54 (09) : 890 - 896
  • [34] Practical aspects of forming ultra-shallow junctions by Sub-keV boron implants
    Foad, MA
    Murrell, AJ
    Collart, EJH
    de Cock, G
    Jennings, D
    Current, MI
    [J]. SI FRONT-END PROCESSING-PHYSICS AND TECHNOLOGY OF DOPANT-DEFECT INTERACTIONS, 1999, 568 : 55 - 63
  • [35] Comparison between the SIMS and MEIS techniques for the characterization of ultra shallow arsenic implants
    Giubertoni, D.
    Bersani, A.
    Barozzi, M.
    Pederzoli, S.
    Iacob, E.
    van den Berg, J. A.
    Werner, M.
    [J]. APPLIED SURFACE SCIENCE, 2006, 252 (19) : 7214 - 7217
  • [36] Ultra-shallow junction formation in silicon using ion implantation
    Univ of Texas, Austin, United States
    [J]. Nucl Instrum Methods Phys Res Sect B, 1-4 (177-183):
  • [37] Ultra-shallow junction formation in SOI using vacancy engineering
    Gwilliam, R. M.
    Cowern, N. E. B.
    Colombeau, B.
    Sealy, B.
    Smith, A. J.
    [J]. PHYSICS OF IONIZED GASES, 2006, 876 : 181 - +
  • [38] Meeting the ultra-shallow junction challenge
    DeJule, Ruth
    [J]. Semiconductor International, 1997, 20 (04): : 50 - 56
  • [39] Plasma doping for ultra-shallow junctions
    Chan, C
    Qin, S
    [J]. MICROELECTRONICS RELIABILITY, 1998, 38 (09) : 1485 - 1488
  • [40] Ultra-shallow junction formation in silicon using ion implantation
    Tasch, AF
    Banerjee, SK
    [J]. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1996, 112 (1-4): : 177 - 183