Thermal Imaging of Encapsulated LEDs

被引：0
|
作者：
Kendig, Dustin [1 ,2 ]
Yazawa, Kazuaki [2 ]
Shakouri, Ali [2 ]
机构：
[1] Microsanj, Cupertino, CA USA
[2] Univ Calif Santa Cruz, Dept Elect Engn, Santa Cruz, CA USA
来源：
2011 27TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM) | 2011年
关键词：
Thermoreflectance; thermography; LED; reliability; heating;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Thermoreflectance imaging is used to obtain 2D temperature maps of encapsulated LED arrays and elements with sub-micron spatial resolution. Typical LED encapsulation is opaque for infrared light, which prevents direct measurement of the semiconductor die with infrared cameras and thermocouples. A lock-in transient imaging technique with a megapixel silicon CCD is used to obtain the thermoreflectance and electroluminescence signals simultaneously. Transient thermal response in different locations of the die is characterized. Different thermal time constants are observed which correspond to various heat transfer mechanisms.
引用
收藏
页码：310 / 313
页数：4
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