Stress relaxation, creep recovery, and Newtonian viscous flow in silicon nitride

A new approach to tensile creep testing and analysis based on stress relaxation is described for sintered silicon nitride. Creep rate data covering up to 5 orders of magnitude are generated in tests lasting less than 1 day. Tests from various initial stresses at temperatures up to 1300 degrees C are analyzed and compared with creep rates measured during conventional constant load testing. It is shown that at least 40% of the creep strain accumulated under all test conditions is recoverable, and that the deformation may properly be described as viscoelastic, A regime which approximated as Newtonian viscous behavior (creep rate directly proportional to stress) was observed during decreasing stress at temperatures between 1200 degrees and 1300 degrees C, This resulted in anomalous behavior at low strains in pseudo stress-strain curves generated from the stress relaxation data. However, the otherwise systematic rate dependence provides a possible basis for design in terms of a secant modulus analysis. The anelastic, recoverable component of creep may lead to complex deformation history-dependent phenomena.