Technologies for Forming Electrodynamic Structures for Millimeter-Wave and Terahertz Vacuum Microelectronic Devices

被引：4
|
作者：
Starodubov, A. V. [1 ,2 ]
Nozhkin, D. A. [1 ]
Rasulov, I. I. [1 ]
Serdobintsev, A. A. [1 ]
Kozhevnikov, I. O. [1 ]
Galushka, V. V. [1 ,2 ]
Sakharov, V. K. [2 ]
Bessonov, D. A. [3 ]
Galkin, A. D. [4 ]
Bakhteev, I. Sh. [5 ]
Molchanov, S. Yu. [5 ]
German, S. V. [6 ,7 ]
Ryskin, N. M. [1 ,2 ]
机构：
[1] Chernyshevsky Saratov State Univ, Saratov 410012, Russia
[2] Russian Acad Sci, Kotelnikov Inst Radioengn & Elect, Saratov Branch, Saratov 410038, Russia
[3] Gagarin Saratov State Tech Univ, Saratov 410054, Russia
[4] Ctr Laser, St Petersburg 195067, Russia
[5] Russian Acad Sci, Inst Solid State Phys, Chernogolovka 142432, Moscow oblast, Russia
[6] Russian Acad Sci, Skolkovskiy Inst Spect, Moscow 108840, Russia
[7] Inst Sci & Technol, Moscow 121205, Russia
来源：
JOURNAL OF COMMUNICATIONS TECHNOLOGY AND ELECTRONICS | 2022年 / 67卷 / 10期
基金：
俄罗斯科学基金会; 俄罗斯基础研究基金会;
关键词：
MEANDER-LINE; W-BAND; HIGH-POWER; TUBE; MICROFABRICATION; FABRICATION; CIRCUITS; DESIGN; GHZ;
D O I：
10.1134/S1064226922100126
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The electrodynamic microstructure technologies for production of millimeter and submillimeter-wave vacuum microelectronic devices are reviewed, including photolithography, deep reactive ion etching, computer numerical control micro- and nanomilling, electro-erosive micromachining, and additive technologies: 3D printing, selective laser sintering, and selective laser melting. An original approach to manufacture of planar slow-wave systems based on magnetron sputtering and laser ablation is discussed. Technological tolerances and surface roughness that can be obtained using the considered technologies are compared.
引用
收藏
页码：1189 / 1197
页数：9
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