Hf-based high-k materials for Si nanocrystal floating gate memories

被引:34
|
作者
Khomenkova, Larysa [1 ]
Sahu, Bhabani S. [2 ]
Slaoui, Abdelilah [2 ]
Gourbilleau, Fabrice [1 ]
机构
[1] ENSICAEN, UCBN 6252, CEA, CIMAP,UMR,CNRS, F-14050 Caen 4, France
[2] CNRS, UDS, InESS, Strasbourg, France
来源
关键词
DIELECTRICS; SUPERLATTICES; SIO2-FILMS; DEVICE; LAYERS;
D O I
10.1186/1556-276X-6-172
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Pure and Si-rich HfO2 layers fabricated by radio frequency sputtering were utilized as alternative tunnel oxide layers for high-k/Si-nanocrystals-SiO2/SiO2 memory structures. The effect of Si incorporation on the properties of Hf-based tunnel layer was investigated. The Si-rich SiO2 active layers were used as charge storage layers, and their properties were studied versus deposition conditions and annealing treatment. The capacitance-voltage measurements were performed to study the charge trapping characteristics of these structures. It was shown that with specific deposition conditions and annealing treatment, a large memory window of about 6.8 V is achievable at a sweeping voltage of +/-6 V, indicating the utility of these stack structures for low-operating-voltage nonvolatile memory devices.
引用
收藏
页数:8
相关论文
共 50 条
  • [21] Comparison of Electrical Measurements with Structural Analysis of Thin High-k Hf-Based Dielectric Films on Si
    Hourdakis, E.
    Theodoropoulou, M.
    Nassiopoulou, A. G.
    Parisini, A.
    Reading, M. A.
    van den Berg, J. A.
    Conard, T.
    Degendt, S.
    ANALYTICAL TECHNIQUES FOR SEMICONDUCTOR MATERIALS AND PROCESS CHARACTERIZATION 6 (ALTECH 2009), 2009, 25 (03): : 363 - 372
  • [22] Effective Work Function Modulation by Aluminum Ion Implantation on Hf-Based High-k/Metal Gate pMOSFET
    Chen, Y. W.
    Lai, C. M.
    Chiang, T. F.
    Cheng, L. W.
    Yu, C. H.
    Chou, C. H.
    Hsu, C. H.
    Chang, W. Y.
    Wu, T. B.
    Lin, C. T.
    IEEE ELECTRON DEVICE LETTERS, 2010, 31 (11) : 1290 - 1292
  • [23] Thickness optimization of the TiN metal gate with polysilicon-capping layer on Hf-based high-k dielectric
    Bae, SH
    Song, SC
    Choi, K
    Bersuker, G
    Brown, GA
    Kwong, DL
    Lee, BH
    MICROELECTRONIC ENGINEERING, 2006, 83 (03) : 460 - 462
  • [24] Influence of preparing process on total-dose radiation response of high-k Hf-based gate dielectrics
    Song, Zhaorui
    Cheng, Xinhong
    Zhang, Enxia
    Xing, Yumei
    Yu, Yuehui
    Zhang, Zhengxuan
    Wang, Xi
    Shen, Dashen
    THIN SOLID FILMS, 2008, 517 (01) : 465 - 467
  • [25] Role of nitrogen incorporation into Hf-based high-k gate dielectrics for termination of local current leakage paths
    Watanabe, H
    Kamiyama, S
    Umezawa, N
    Shiraishi, K
    Yoshida, S
    Watanabe, Y
    Arikado, T
    Chikyow, T
    Yamada, K
    Yasutake, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2005, 44 (42-45): : L1333 - L1336
  • [26] Spatial fluctuation of dielectric properties in Hf-based high-k gate films studied by scanning capacitance microscopy
    Naitou, Y
    Ando, A
    Ogiso, H
    Kamiyama, S
    Nara, Y
    Nakamura, K
    Watanabe, H
    Yasutake, K
    APPLIED PHYSICS LETTERS, 2005, 87 (25) : 1 - 3
  • [27] Unique behavior of F-centers in high-k Hf-based oxides
    Umezawa, N
    Shiraishi, K
    Ohno, T
    Boero, M
    Watanabe, H
    Chikyow, T
    Torii, K
    Yamabe, K
    Yamada, K
    Nara, Y
    PHYSICA B-CONDENSED MATTER, 2006, 376 : 392 - 394
  • [28] Advanced nanoanalysis of a Hf-based high-k dielectric stack prior to activation
    MacKenzie, M.
    Craven, A. J.
    McComb, D. W.
    De Gendt, S.
    Docherty, F. T.
    McGilvery, C. M.
    McFadzean, S.
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2007, 10 (06) : G33 - G35
  • [29] Hf-based high-k dielectrics: Process development, performance characterization, and reliability
    IBM T. J.Watson Research Center, Yorktown Heights, NY
    不详
    Synth. Lect. Solid State Mater., 2006, (1-92):
  • [30] Wet etching characteristics of a HfSiON high-k dielectric in HF-based solutions
    Li Yongliang
    Xu Qiuxia
    JOURNAL OF SEMICONDUCTORS, 2010, 31 (03)