Intra/inter-chip CDMA communications for efficient data transmission towards new paradigm of computing

被引:0
|
作者
Yuminaka, Y [1 ]
机构
[1] Gunma Univ, Fac Engn, Dept Elect Engn, Kiryu, Gumma 3768515, Japan
关键词
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
This paper proposes applications of a code-division multiple access (CDMA) technique to efficient data transmission for new-paradigm VLSI systems. A pseudo-random orthogonal m-sequence carrier is employed as a multiplexable information carrier to realize efficient data transmission. Using orthogonal property of m-sequences, it is possible to multiplex several computational activities into a single circuit, and execute in parallel using multiplexed data transmission with reduced interconnection. Also, randomness of m-sequences offers the high tolerance to interference, and suppression of dynamic range of signals. In order to introduce a CDMA technique to "wired" intra/inter-chip communication, we develop multiple-valued m-sequences, an equalization technique and compact current-mode MOS circuits. The Spice and MATLAB simulation results of MV-CDMA systems demonstrate the excellent capabilities of eliminating co-channel interference inherent in wired-CDMA systems.
引用
收藏
页码:603 / 618
页数:16
相关论文
共 15 条
  • [2] An Efficient Ladder Reflector Antenna for Inter-Chip Communications
    Jiang, Bo-Tao
    Mao, Jun-Fa
    Yin, Wen-Yan
    [J]. APMC: 2008 ASIA PACIFIC MICROWAVE CONFERENCE (APMC 2008), VOLS 1-5, 2008, : 2631 - +
  • [3] AN EFFICIENT CMOS ON-CHIP LADDER REFLECTOR ANTENNA FOR INTER-CHIP COMMUNICATIONS
    Jiang, Bo-Tao
    Mao, Jun-Fa
    [J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2009, 51 (01) : 59 - 63
  • [4] Power reduction in high-speed inter-chip data communications
    Kuroda, T
    [J]. 2005 6TH INTERNATIONAL CONFERENCE ON ASIC PROCEEDINGS, BOOKS 1 AND 2, 2005, : 3 - 7
  • [5] Non-contact inter-chip data communications technology for system in a package
    Kuroda, T
    [J]. 2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS, 2004, : 1347 - 1352
  • [6] Design and Modeling of a Terahertz Transceiver for Intra- and Inter-Chip Communications in Wireless Network-on-Chip Architectures
    Paudel, Biswash
    Li, Xue Jun
    Seet, Boon-Chong
    [J]. SENSORS, 2024, 24 (10)
  • [7] Plasmonic Nanoantennas for 6G Intra/Inter-Chip Optical-Wireless Communications
    Alves, A. A. C.
    Melo, M. C.
    Siqueira, J. J.
    Zanella, F.
    Mejia-Salazar, J. R.
    Arismar Cerqueira, S., Jr.
    [J]. 2020 2ND 6G WIRELESS SUMMIT (6G SUMMIT), 2020,
  • [8] Demonstration of Inter-Chip RF Data Transmission Using On-Chip Antennas in Silicon Photonics
    Radi, Bahaa
    Dhillon, Ajaypal Singh
    Liboiron-Ladouceur, Odile
    [J]. IEEE PHOTONICS TECHNOLOGY LETTERS, 2020, 32 (11) : 659 - 662
  • [9] Intra- and Inter-Chip Transmission of Millimeter-Wave Interconnects in NoC-Based Multi-Chip Systems
    Narde, Rounak Singh
    Venkataraman, Jayanti
    Ganguly, Amlan
    Puchades, Ivan
    [J]. IEEE ACCESS, 2019, 7 : 112200 - 112215
  • [10] A 1.2 Gbps non-contact 3D-stacked inter-chip data communications technology
    Mizoguchi, D
    Miura, N
    Sakurai, T
    Kuroda, T
    [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (03): : 320 - 326