Modeling analysis of a triaxial microaccelerometer with piezoelectric thin-film sensing using energy method

This study applies energy method to derive the system modeling of a triaxial microaccelerometer that consists of a quadri-beam suspension, a seismic mass, and displacement transducers using piezoelectric thin films. Two suspension beams support both ends of the seismic mass, which is fabricated by anisotropic etching of silicon. An out-of-plane acceleration will result in a symmetric bend, and in-plane accelerations will produce asymmetric bend and torsion of the suspension beams. Two piezoelectric thin-film transducers are arranged at both ends of each suspension beam. Eight transducers in total are interconnected such that triaxial accelerations can be measured selectively. The structure stiffness of the suspension beams considers both the silicon beams and piezoelectric films by the use of the laminated beam theory. Therefore, the analytical model is applicable to the accelerometers with thick piezoelectric films. The model is based on the anisotropic material properties of Silicon and PZT and Euler's beam equation with the assumptions that smaller strains and stresses are negligible. The analytical results of the resonant frequencies and sensor sensitivities to triaxial accelerations are presented and confirmed by finite element analysis.