Innovating at Cloud Speed for IoT, AI, and Semiconductor Design

被引:0
|
作者
Pellerin, David B. [1 ]
机构
[1] Amazon Web Serv, Seattle, WA 98109 USA
关键词
Cloud; IoT; Electronic Design Automation; Artificial Intelligence;
D O I
10.1145/3194554.3200205
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Rapid adoption and production deployments of connected devices, coupled with AI-driven methods of advanced analytics, have led to an explosion in demand for non-traditional, more scalable computing and data management platforms. This increasing demand is being seen in the public cloud as well as in cloud-connected IoT edge devices. AI is at the heart of many the newest, most advanced analytics and IoT applications, ranging from robotics and autonomous vehicles, to cloud-connected products such as Amazon Alexa, to smart factories and consumer-facing services in the financial and healthcare sectors. This talk presents examples of such use-cases within Amazon, as well examples of how Amazon customers increasingly rely on AI coupled with IoT hardware and software stacks, and use cloud-based EDA to innovate faster, and at cloud scales.
引用
收藏
页码:511 / 511
页数:1
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