Thermal Challenges for Heterogeneous 3D ICs and Opportunities for Air Gap Thermal Isolation

被引：0
|
作者：
Zhang, Yang [1 ]
Sarvey, Thomas E. [1 ]
Bakir, Muhannad S. [1 ]
机构：
[1] Georgia Inst Technol, 791 Atlantic Dr, Atlanta, GA 30332 USA
来源：
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) | 2014年
关键词：
3D IC; DRAM; microbumps; microfluidic heat sink (MFHS); multicore processor; TSVs; DRAM;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Thermal crosstalk within a heterogeneous 3D IC results in higher temperatures for low-power dice; this is particularly true in memory-logic, photonic-logic, and MEMS-logic stacks. The elevated temperatures may consequently impact the performance of the low-power devices. This paper describes a thermal solution for both heat removal as well as thermal isolation within a 3D chip stack. Based on the evaluated memorylogic 3D architecture and compared to conventional air-cooling, the proposed technologies reduce the maximum temperature of the memory die from 75.6 degrees C to 36.7 degrees C and processor die from 75.9 degrees C to 60.1 degrees C.
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页数：5
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