The Novel TEM Sample Preparations Technique for Long Dimension Trench

被引：0

作者：

Chou, Po Fu ^{[1
]}

Fang, Shu Mei ^{[1
]}

机构：

[1] United Microelect Corp Ltd, Hsinchu 300, Taiwan

来源：

2011 18TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2011年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel ex-situ sample preparation technique is introduced in this paper. By thinning a deep trench or high aspect ratio structure perpendicular to the long dimension (i.e., from the side) to instead of thinning from perpendicular to the short dimension (either the top or the bottom), it is possible to obtain a more uniformly thin TEM specimen over the entire long dimension of the structure. This article will describe the sample preparation procedure and show some case studies to demonstrate the capability of this technique.

引用

页数：4

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