Yield strength of thin-film parylene-C

被引:0
|
作者
Shih, VCY [1 ]
Harder, TA [1 ]
Tai, YC [1 ]
机构
[1] CALTECH, Caltech Micromachining Lab, Dept Elect Engn, Pasadena, CA 91125 USA
来源
DTIP 2003: DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2003 | 2003年
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
For the first time, the yield strength of thin-film parylene-c is measured from membrane load-deflection experiments and surface profile analysis. To do so, the onset pressure which causes plastic deformation of the membrane is first experimentally measured. Then a new 2-step displacement model, together with the energy minimization technique[l], is developed to convert the onset pressure to the yield strength on the pre-stressed parylene membrane under a uniform pressure loading. The results depict a Yield Strength of 59 MPa (or 0.012 of strain) for thin-film parylene-c in comparison to 55 MPa reported by parylene vendor (measured from large samples)[2]. To double check with the result, the balloon model[3] is further used to compare with the stress value from our model at the center of parylene membranes and good agreements are obtained.
引用
收藏
页码:394 / 398
页数:5
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