Flip chip microassembly of a silicon triaxial force sensor on flexible substrates

被引：14

作者：

Sieber, Ame ^{[1
]}

Valdastri, Pietro ^{[2
]}

Houston, Keith ^{[2
]}

Menciassi, Arianna ^{[2
]}

Dario, Paolo ^{[2
]}

机构：

[1] ARC Seibersdorf Res GmbH, Seibersdorf, Austria

[2] Scuola Super Sant Anna, Polo St Anna Valdera, CRIM Lab, Pisa, Italy

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2008年 / 142卷 / 01期

关键词：

MEMS; microassembly; anisotropic film; bonding; flip chip;

D O I：

10.1016/j.sna.2007.02.042

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Miniaturization of microelectromechanical systems (MEMS) based devices can be achieved by flip chip assembly directly onto a flexible circuit substrate. The main goal of this work was the selection of a suitable bonding material and process to enable scaling down of MEMS sensorized devices for biomedical applications. Finally, the heat bondable anisotropic conductive film 5552R (3M) allowed mechanical robust and low resistance electrical bondings together with a short process cycle time. (c) 2007 Elsevier B.V. All rights reserved.

引用

页码：421 / 428

页数：8

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