NUMERICAL ANALYSIS OF THE RESIDUAL STRESSES IN Z-PINNED COMPOSITE LAMINATES DURING THE CURING PROCESS

被引:0
|
作者
Li, S. [1 ]
Zhang, J. Q. [2 ]
Guo, Z. S. [1 ]
Hu, H. J. [1 ]
机构
[1] Shanghai Univ, Shanghai Inst Appl Math & Mech, Shanghai 20072, Peoples R China
[2] Shanghai Univ, Dept Mech, Shanghai Key Lab Mech Energy & Environm Engn, Shanghai 200444, Peoples R China
关键词
residual stress; cure; chemical shrinkage; thermal expansion; z-pin;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study the residual stresses in z-pinned composites induced during process are analyzed by FE model. The model is composed of resin-rich region, composite and pin. The chemical shrinkage and thermal expansion of the matrix during curing are considered in this model. The interface between resin-rich region and composite or pin is studied in detail. The higher stresses are located at the vicinity of the interface. The stresses decrease quickly with distance away from the interface.
引用
收藏
页码:683 / +
页数:2
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