Viscosity of liquid Cu-In-Sn alloys

被引：12
|
作者：
Yakymovych, A. [1 ,2 ]
Vus, V. [2 ]
Mudry, S. [2 ]
机构：
[1] Univ Vienna, Dept Inorgan Chem Funct Mat, Wahringer Str 42, A-1090 Vienna, Austria
[2] Ivan Franko Natl Univ, Dept Met Phys, Kyrylo & Mephodiy Str 8, UA-79005 Lvov, Ukraine
来源：
JOURNAL OF MOLECULAR LIQUIDS | 2016年 / 219卷
基金：
奥地利科学基金会;
关键词：
Viscosity; Liquid alloys; Cu-In-Sn; Activation energy of viscous flow; SB-SN; ENTHALPIES;
D O I：
10.1016/j.molliq.2016.04.055
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Measuring the viscosity of liquid Cu85In11Sn4, Cu80In15Sn5, Cu75In15Sn10, Cu55In7Sn38, Cu33In50Sn17, and Cu26In55Sn19 alloys has been performed using an oscillating-cup method. The temperature dependencies of the viscosity of liquid Cu-In-Sn alloys obtained show a decrease in viscosity values and an increase in temperature, in accordance with an exponential Arrhenius-type equation. The dynamic viscosity coefficient has been calculated by a number of thermodynamic models across three sections Cu85In15-In15Sn85, Cu-In75Sn25 and In-Cu60Sn40 at 1073 K. A satisfactory agreement has been found between experimental and calculated data. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码：845 / 850
页数：6
相关论文
共 50 条
  • [31] Calorimetric investigations of liquid Cu-Sb, Cu-Sn and Cu-Sn-Sb alloys
    Lee, J.J.
    Kim, B.J.
    Min, W.S.
    Journal of Alloys and Compounds, 1993, 202 (1-2) : 237 - 242
  • [32] CALORIMETRIC INVESTIGATIONS OF LIQUID CU-SB, CU-SN AND CU-SN-SB ALLOYS
    LEE, JJ
    KIM, BJ
    MIN, WS
    JOURNAL OF ALLOYS AND COMPOUNDS, 1993, 202 : 237 - 242
  • [33] Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys
    Chien-Neng Liao
    Ching-Hua Lee
    Journal of Materials Research, 2008, 23 : 3303 - 3308
  • [34] A pseudopotential approach to the viscosity of liquid Cu-based alloys
    Terzieff, Peter
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 473 (1-2) : 195 - 200
  • [35] Viscosity of Al–Cu liquid alloys: measurement and thermodynamic description
    Michael Schick
    Jürgen Brillo
    Ivan Egry
    Bengt Hallstedt
    Journal of Materials Science, 2012, 47 : 8145 - 8152
  • [36] Density and viscosity of ternary Al–Cu–Si liquid alloys
    Hidekazu Kobatake
    Julianna Schmitz
    Jürgen Brillo
    Journal of Materials Science, 2014, 49 : 3541 - 3549
  • [37] Demonstrating 170 °C Low-Temperature Cu-In-Sn Wafer-Level Solid Liquid Interdiffusion Bonding
    Vuorinen, Vesa
    Ross, Glenn
    Klami, Anton
    Dong, Hongqun
    Paulasto-Krockel, Mervi
    Wernicke, Tobias
    Poenninger, Anneliese
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (03): : 446 - 453
  • [38] WETTABILITY AND INTERACTION BETWEEN CU-NB ALLOYS AND LIQUID SN ALLOYS
    MORI, N
    HONGOU, H
    OGI, K
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1988, 52 (03) : 355 - 362
  • [39] Correlation between viscosity of molten Cu-Sn alloys and phase diagram
    Mao Tan
    Bian Xiufang
    Xue Xianying
    Zhang Yanning
    Guo Jing
    Sun Baoan
    PHYSICA B-CONDENSED MATTER, 2007, 387 (1-2) : 1 - 5
  • [40] Surface tension and density of liquid Sn-Cu alloys
    Fima, Przemyslaw
    APPLIED SURFACE SCIENCE, 2010, 257 (02) : 468 - 471
12345