CONTACT RESISTANCE OF ANISOTROPIC CONDUCTIVE ADHESIVE FILM BASED FLIP-CHIP ON GLASS PACKAGES

被引：0

作者：

Uddin, M. A. ^{[1
,2
]}

Chan, H. P. ^{[1
]}

机构：

[1] City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China

[2] AUT Univ, Inst Biomed Technol, Auckland, New Zealand

来源：

REVIEWS ON ADVANCED MATERIALS SCIENCE | 2011年 / 27卷 / 02期

关键词：

ELECTRICAL CHARACTERISTICS; JOINTS; RELIABILITY; STRENGTH; TEMPERATURE; SUBSTRATE;

D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In a flip-chip-on-glass (FCOG) assembly, anisotropic conductive film (ACF) is used as the adhesive to bind the desired interconnection between the flip chip and glass substrate. However, it remains a challenge to develop the ACF bonded flip chip packages with low contact resistance. Considerable research has been conducted recently to investigate the effect of different parameters on the contact resistance. This review article will discuss the critical issues that can easily control the contact resistance of ACF joints in flip chip on glass packages. These mainly include surface cleanliness, bonding tracks, process parameters and operating environmental related issues. The findings can serve as a guide for minimizing the contact resistance of flip chip on glass packages with ACF. By such minimization, ACE can be used as an environmental friendly solder replacement in the very large scale integration (VLSI) industry.

引用

页码：151 / 157

页数：7

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