RECYCLING OF PRINTED CIRCUIT BOARDS BY DIRECT MOLDING TECHNOLOGY

被引:0
|
作者
Quadrini, F. [1 ]
Bellisario, D. [1 ]
Tedde, G. M. [1 ]
Santo, L. [1 ]
机构
[1] Univ Tor Vergata, Rome, Italy
关键词
WASTE; RECOVERY; METALS; END;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The recovery and reuse of printed circuit boards (PCBs) is becoming crucial in the management of electronic waste that is undergoing an exponential increase. In this study, a simple and eco-friendly process for recycling waste PCBs is discussed. In particular, composite panels were produced by reusing 100% of waste PCBs without the addition of any additive or virgin material. After a two-step grinding process, ground PCB was used to mold panels by direct molding which is pure compression molding without material sorting. Results were very promising in terms of process feasibility and part performances. Molded samples had density about 1.45 g/cm(3), flexural modulus and flexural about 3 GPa and 16 MPa, respectively. A smooth surface with low friction coefficient was obtained for the recycled panels. The study shows that despite the presence of metal and other non-metal non-organic fractions, waste PCBs can be re-processed in profitable and environmentally conscious way without the addition of any bonding agent or additive. The recycling technology can be extended to the reuse of the non-metallic fraction only, after separation and recovery of metals.
引用
收藏
页数:6
相关论文
共 50 条
  • [21] Recycling of waste printed circuit boards into ion exchange resin
    Zhang, Jianqiu
    Tian, Tao
    Chen, Jinyang
    Zu, Jianhua
    Wang, Yangjun
    [J]. RSC ADVANCES, 2015, 5 (03) : 2080 - 2087
  • [22] A physical process for recycling and reusing waste printed circuit boards
    Mou, P
    Wa, LD
    Xiang, D
    Gao, JG
    Duan, GH
    [J]. PROCEEDINGS OF THE 2004 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS & THE ENVIRONMENT, CONFERENCE RECORD, 2004, : 237 - 242
  • [23] Pyrometallurgy coupling bioleaching for recycling of waste printed circuit boards
    Chu, Huichao
    Qian, Can
    Tian, Bingyang
    Qi, Shiyue
    Wang, Jia
    Xin, Baoping
    [J]. RESOURCES CONSERVATION AND RECYCLING, 2022, 178
  • [24] Review and Prospects of Recycling Methods for Waste Printed Circuit Boards
    Yu, Jinglei
    Williams, Eric
    Ju, Meiting
    [J]. 2009 IEEE INTERNATIONAL SYMPOSIUM ON SUSTAINABLE SYSTEMS AND TECHNOLOGY, 2009, : 351 - +
  • [25] Direct legend printing (DLP) on printed circuit boards using piezoelectric inkjet technology
    Clay, Kim
    Gardner, Ian
    Bresler, Eric
    Seal, Mike
    Speakman, Stuart
    [J]. Circuit World, 2001, 28 (02) : 24 - 31
  • [26] Optimisation of direct laser structuring of printed circuit boards
    Rozman, Robert
    Kmetec, Blaz
    Podobnik, Bostjan
    Kovacic, Drago
    Govekar, Edvard
    [J]. APPLIED SURFACE SCIENCE, 2008, 254 (17) : 5524 - 5529
  • [27] An optical interconnection technology for multilayer printed circuit boards
    Griese, E
    [J]. LEOS 2000 - IEEE ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS. 1 & 2, 2000, : 230 - 231
  • [28] Laser Technology for Use in Recycyling Printed Circuit Boards
    G. V. Kuznetsov
    M. D. Kats
    I. M. Kats
    [J]. Chemical and Petroleum Engineering, 2022, 58 : 491 - 498
  • [29] Laser Technology for Use in Recycyling Printed Circuit Boards
    Kuznetsov, G., V
    Kats, M. D.
    Kats, I. M.
    [J]. CHEMICAL AND PETROLEUM ENGINEERING, 2022, 58 (5-6) : 491 - 498
  • [30] Current status and future perspective of waste printed circuit boards recycling
    Zeng, Xianlai
    Zheng, Lixia
    Xie, Henghua
    Lu, Bin
    Xia, Kai
    Chao, Kuoming
    Li, Weidong
    Yang, Jianxin
    Lin, Szuyin
    Li, Jinhui
    [J]. SEVENTH INTERNATIONAL CONFERENCE ON WASTE MANAGEMENT AND TECHNOLOGY (ICWMT 7), 2012, 16 : 590 - 597