Plastic packaging modeling and characterization at RF/microwave frequencies

被引：0
|
作者：
Riad, SM
Su, WS
Salama, I
ElshabiniRiad, A
机构：
来源：
3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS | 1997年
关键词：
D O I：
10.1109/ISAPM.1997.581280
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：147 / 147
页数：1
相关论文
共 50 条
  • [1] Plastic packaging modeling and characterization at RF/microwave frequencies
    Riad, Sedki M.
    Su, Wansheng
    Salama, Iman
    Elshabini-Riad, Aicha
    Rachlin, Michael
    Baker, Walter
    Perdue, James
    [J]. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1997,
  • [2] RF/microwave surface mount plastic package modeling and characterization
    Riad, SM
    Su, WS
    Salama, I
    ElshabiniRiad, A
    Rachlin, M
    Baker, WG
    Perdue, J
    [J]. 1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 500 - 507
  • [3] Characterization of bump arrays at RF/microwave frequencies
    Ndip, IN
    Sommer, G
    John, W
    Reichl, H
    [J]. MICROELECTRONICS RELIABILITY, 2005, 45 (3-4) : 551 - 558
  • [4] Packaging and interconnect for RF and microwave
    Collander, P
    Passiopoulos, G
    [J]. CERAMIC INTERCONNECT TECHNOLOGY: NEXT GENERATION, 2003, 5231 : 73 - 78
  • [5] Packaging and interconnect for RF and microwave
    Collander, P
    [J]. INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2002, 32 (04): : 269 - 271
  • [6] HBT optoelectronic mixer at microwave frequencies: Modeling and experimental characterization
    Lasri, J
    Betser, Y
    Sidorov, V
    Cohen, S
    Ritter, D
    Orenstein, M
    Eisenstein, G
    [J]. JOURNAL OF LIGHTWAVE TECHNOLOGY, 1999, 17 (08) : 1423 - 1428
  • [7] RF characteristic and modeling of the RF MEMS switch packaging
    Wu Han-qin
    Liao Xiao-ping
    [J]. ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 515 - +
  • [8] BATTLING PHASE NOISE AT RF AND MICROWAVE FREQUENCIES
    Hansen, John
    [J]. MICROWAVE JOURNAL, 2011, 54 (04) : 104 - +
  • [9] Transport conductivity of graphene at RF and microwave frequencies
    Awan, S. A.
    Lombardo, A.
    Colli, A.
    Privitera, G.
    Kulmala, T. S.
    Kivioja, J. M.
    Koshino, M.
    Ferrari, A. C.
    [J]. 2D MATERIALS, 2016, 3 (01):
  • [10] A Way to Modern and Cost Effective Packaging for RF Frontends for Use from Microwave through Millimeter Wave Frequencies
    Brokmeier, Axel
    Geist, Thomas
    Puchinger, Juergen
    [J]. 40TH EUROPEAN MICROWAVE CONFERENCE, 2010, : 609 - 611
12345