Evaluating the repair of System-on-Chip (SoC) using connectivity

被引：0

作者：

Choi, M ^{[1
]}

Park, N ^{[1
]}

Piuri, V ^{[1
]}

Kim, YB ^{[1
]}

Lombardi, F ^{[1
]}

机构：

[1] Univ Missouri, Dept ECE, Rolla, MO 65409 USA

来源：

IMTC/O3: PROCEEDINGS OF THE 20TH IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2003年

关键词：

reconfigurable system-on-chip (RSoC); repair; configurability; repairability; connectivity; reliability;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper presents a new model for analyzing the repairability of RSoC (Reconfigurable System-on-Chip) Instrumentation with repair process. It exploits the connectivity of the interconnected cores in which un-reliability factors due to both neighboring cores and interconnect structure are taken into account Based on the connectivity, two RSoC repair scheduling strategies, Minimum Number of Interconnections First (I-MIN) and Minimum Number of Neighboring Cores First (C-MIN) are proposed. Two other scheduling strategies, Maximum Number of Interconnections First (I-MAX) and Maximum Number of Neighboring Cores First (C-MAX) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall repairability of RSoCs. Extensive parametric simulations demonstrate the efficiency of the proposed RSoC repair scheduling strategies, thereby manufacturing ultimately reliabile RSoC instrumentation can be achieved.

引用

页码：309 / 314

页数：6

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