Impulse withstand voltage between foil conductors on printed wiring board

被引:0
|
作者
Yamano, Y. [1 ]
Shutoh, K. [2 ]
机构
[1] Chiba Univ, Fac Educ, Inage Ku, Chiba 2638522, Japan
[2] Tokyo Univ Sci, Fac Sci & Technol, Noda, Chiba 2788510, Japan
关键词
impulse withstand voltage; printed wiring board; surface flashover; narrow gap; backing electrode; foil electrode;
D O I
10.1109/TDEI.2008.4483453
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The impulse flashover voltage (FOV) in air across a short gap between foil conductors on a printed wiring board was studied to obtain fundamental and remarkable characteristics that will be useful in the design of wiring on the board. Two types of conductor configuration on the test boards were studied. The studied gap distance (d) ranged from 20 mu m to 1200 mu m. The board thicknesses (t) and the foil thickness (s) were changed from 60 mu m to 800 mu m and from 6 mu m to 18 mu m, respectively. The following results were obtained in the two types of the conductor configuration. FOVs for the boards in the studied rang e are independent of the foil thickness. FOV is almost un-influenced by the board thickness in the gap distance range shorter than 30 mu m or 50 mu m. In the gap distance longer than this range, FOV characteristics strictly depend on the board thickness; FOV for t=60 mu m steeply increases with an increase in the gap distance, and FOV for t=800 mu m gradually increases with an increase in the gap distance. These experimental results were discussed basing upon the calculation results of electric field around the HV foil conductor edge.
引用
收藏
页码:357 / 365
页数:9
相关论文
共 50 条
  • [31] New epoxy resins for printed wiring board applications
    Hoevel, Bernd
    Valette, Ludovic
    Gan, Joseph
    CIRCUIT WORLD, 2007, 33 (02) : 17 - 27
  • [32] Development of new printed wiring board with coaxial wirings
    Sato, Y
    Tanaka, N
    Kikuchi, K
    Nakagawa, H
    Tokoro, K
    Kawashima, A
    Kawamata, Y
    Kobayashi, K
    Aoyagi, M
    2002 INTERNATIONAL CONFERENCE ON ADVANCED PACKAGING AND SYSTEMS, PROCEEDINGS, 2002, 4828 : 92 - 97
  • [33] Parametric study of warpage in printed wiring board assemblies
    Ding, H
    Ume, IC
    Powell, RE
    Hanna, CR
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (03): : 517 - 524
  • [34] A novel technology for stacking microvias on printed wiring board
    Liu, FH
    White, GE
    Sundaram, V
    Aggarwal, AO
    Hosseini, SM
    Sutter, D
    Tummala, RR
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1134 - 1139
  • [35] The electrochemical recycling of printed-wiring-board etchants
    P. Adaikkalam
    G. N. Srinivasan
    K. V. Venkateswaran
    JOM, 2002, 54 : 48 - 50
  • [36] HIGH-DENSITY MULTILAYER PRINTED WIRING BOARD
    KOBUNA, H
    NOGUCHI, S
    ATARASHI, T
    NEC RESEARCH & DEVELOPMENT, 1979, (53): : 30 - 35
  • [37] Integrated microfluidic components on a printed wiring board platform
    Lian, Keryn
    O'Rourke, Shawn
    Sadler, Daniel
    Eliacin, Manes
    Gamboa, Claudia
    Terbrueggen, Robert
    Chason, Marc
    SENSORS AND ACTUATORS B-CHEMICAL, 2009, 138 (01): : 21 - 27
  • [38] GREEN PYROLYSIS OF USED PRINTED WIRING BOARD POWDERS
    Zuo, Xiangjun
    Damoah, Lucas N. W.
    Zhang, Lifeng
    Schuman, Thomas
    Kers, Jaan
    RECYCLING OF ELECTRONIC WASTE II: PROCEEDINGS OF THE SECOND SYMPOSIUM, 2011, : 17 - 24
  • [39] Nonlinear dynamics analysis of a laminated printed wiring board
    He, XL
    Fulton, RE
    JOURNAL OF ELECTRONIC PACKAGING, 2002, 124 (02) : 77 - 84
  • [40] AUTOMATED PRINTED-WIRING-BOARD DESIGN.
    Spear, Amy C.
    RCA Engineer, 1975, 21 (02): : 23 - 25