Impulse withstand voltage between foil conductors on printed wiring board

被引:0
|
作者
Yamano, Y. [1 ]
Shutoh, K. [2 ]
机构
[1] Chiba Univ, Fac Educ, Inage Ku, Chiba 2638522, Japan
[2] Tokyo Univ Sci, Fac Sci & Technol, Noda, Chiba 2788510, Japan
关键词
impulse withstand voltage; printed wiring board; surface flashover; narrow gap; backing electrode; foil electrode;
D O I
10.1109/TDEI.2008.4483453
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The impulse flashover voltage (FOV) in air across a short gap between foil conductors on a printed wiring board was studied to obtain fundamental and remarkable characteristics that will be useful in the design of wiring on the board. Two types of conductor configuration on the test boards were studied. The studied gap distance (d) ranged from 20 mu m to 1200 mu m. The board thicknesses (t) and the foil thickness (s) were changed from 60 mu m to 800 mu m and from 6 mu m to 18 mu m, respectively. The following results were obtained in the two types of the conductor configuration. FOVs for the boards in the studied rang e are independent of the foil thickness. FOV is almost un-influenced by the board thickness in the gap distance range shorter than 30 mu m or 50 mu m. In the gap distance longer than this range, FOV characteristics strictly depend on the board thickness; FOV for t=60 mu m steeply increases with an increase in the gap distance, and FOV for t=800 mu m gradually increases with an increase in the gap distance. These experimental results were discussed basing upon the calculation results of electric field around the HV foil conductor edge.
引用
收藏
页码:357 / 365
页数:9
相关论文
共 50 条
  • [1] Characteristics of surface flashover between foil conductors on printed wiring board
    Yamano, Y
    Takaoka, Y
    PROCEEDINGS OF THE 7TH INTERNATIONAL CONFERENCE ON PROPERTIES AND APPLICATIONS OF DIELECTRIC MATERIALS, VOLS 1-3, 2003, : 111 - 114
  • [2] Surge endurance between foil conductors across a narrow gap on printed wiring board
    Yamano, Yoshiaki
    Shutoh, Katsuhiko
    Kando, Masaaki
    Okamoto, Katsuhiro
    IEEJ Transactions on Fundamentals and Materials, 2007, 127 (02) : 121 - 127
  • [3] AC and impulse breakdown of polluted surface on printed wiring board
    Yamada, S
    Okamoto, K
    Haga, K
    PROCEEDINGS: ELECTRICAL INSULATION CONFERENCE AND ELECTRICAL MANUFACTURING & COIL WINDING CONFERENCE, 1997, : 805 - 809
  • [4] Prediction of voltage induced between wirings on printed wiring board by external fields
    Harada, T
    Shinohara, S
    Sato, R
    1998 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, VOLS 1 AND 2, 1998, : 929 - 934
  • [5] Wiring statistics and printed wiring board thermal conductivity
    Nelson, RD
    SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001, 2001, : 252 - 260
  • [7] Optical interconnect on printed wiring board
    Karppinen, M
    Mäkinen, JT
    Kataja, K
    Tanskanen, A
    Alajoki, T
    Karioja, P
    Immonen, M
    Kivilahti, J
    PHOTONICS PACKAGING AND INTEGRATION IV, 2004, 5358 : 135 - 145
  • [8] Controlling the coefficient of thermal expansion of printed wiring board using copper-invar-copper foil
    Johannes, William R.
    Johnson, Wray
    International Journal of Microcircuits and Electronic Packaging, 1994, 17 (02): : 135 - 142
  • [9] Microfluidic systems on a printed wiring board platform
    Lian, Keryn
    O'Rourke, Shawn
    Sadler, Daniel
    Eliacin, Manes
    Gamboa, Claudia
    Terbrueggen, Robert
    Chason, Marc
    CIRCUIT WORLD, 2009, 35 (03) : 12 - 20
  • [10] The printed wiring board is turning into an electrial system
    Riester, M.
    ELEKTROTECHNIK UND INFORMATIONSTECHNIK, 2006, 123 (09): : 363 - 368