The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

被引：0
|
作者：
Yan, JC [1 ]
Xu, ZW [1 ]
Wu, GH [1 ]
Yang, SQ [1 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding Prod Technol, Harbin 150001, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE | 2005年 / 40卷 / 19期
基金：
中国国家自然科学基金;
关键词：
D O I：
10.1007/s10853-005-4394-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
An investigatory study was conducted to observe the evolution of interface structure in transient liquid phase (TLP) bonded joints of Al2O 3p/6061Al composites with Cu/Ni/Cu interlayers. The materials used were cylindrical rods of Al-MMCs. The morphologies, chemical composition and structures of the phases formed in TLP bonded joints were investigated by scanning electron microscopy (SEM) and x-ray diffraction (XRD). The results show that with the continuance of the diffusion process, the composition of the Al-Cu liquid phase adjacent to Al-MMCs deviates from the eutectic point, and an Al-based solid solution layer forms during solidification.
引用
收藏
页码：5307 / 5309
页数：3
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