Structure of the near-surface layer of Cz Si wafers subjected to low-temperature low-energy ion-beam treatment

被引:0
|
作者
Fedotov, Alexander [1 ]
Ivashkevich, Inna [2 ]
Kobeleva, Svetlana [3 ]
Korolik, Olga [1 ]
Mazanik, Alexander [1 ]
Stas'kov, Nikola [2 ]
Turishchev, Sergey [4 ]
机构
[1] Belarusian State Univ, Nezavisimosti 4, Minsk 220030, BELARUS
[2] Mogilev State Univ, Mogilev 212022, BELARUS
[3] Moscow Inst Steels & Alloys, Moscow 119049, Russia
[4] Voronezh State Univ, Voronezh 394006, Russia
关键词
silicon; ion beam treatment; oxidation; amorphization;
D O I
10.1002/pssc.201000331
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The general goal of this work is to study the near-surface region structure of Cz Si wafers subjected to the low-temperature (25-350 degrees C) low-energy (300 eV) ion-beam treatment by hydrogen, helium or argon. The properties of a thin (several nanometers) near-surface layer of the wafers were investigated using the X-ray absorption near edge structure (XANES), X-ray photoelectron spectroscopy (XPS), and spectroscopic ellipsometry methods. Based on the conducted study, it was concluded that the ion beam treatment leads to (i) the formation of an oxide layer on the surface and to (ii) silicon amorphization. It is demonstrated that increase of the hydrogen ion-beam treatment temperature results in (i) improvement of the oxide quality; (ii) reduced thickness of the transition region between the formed oxide layer and silicon bulk. (C) 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:739 / 742
页数:4
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