Extending the limits of air-cooling in microelectronic equipment

被引：0

作者：

Rodgers, P ^{[1
]}

Eveloy, V ^{[1
]}

Pecht, MG ^{[1
]}

机构：

[1] Univ Maryland, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA

来源：

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS | 2005年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

引用

页码：695 / 702

页数：8

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