Reliability of solder joint and SMT assembly

被引：0
|
作者：
Sandera, J [1 ]
机构：
[1] Brno Univ Technol, Dept Microelect, Brno, Czech Republic
来源：
2005 Spanish Conference on Electron Devices, Proceedings | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：73 / 76
页数：4
相关论文
共 50 条
  • [31] Reliability Test and Analysis for Vibration-Induced Solder Joint Failure of PBGA Assembly
    Zhou, Bin
    En, Yunfei
    Qi, Xueli
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 921 - 924
  • [32] Assuring solder joint reliability in repair
    Electronic Packaging and Production, 1994, 34 (09):
  • [33] FLOW PROCESSES IN SOLDER PASTE DURING STENCIL PRINTING FOR SMT ASSEMBLY
    MANNAN, SH
    EKERE, NN
    ISMAIL, I
    CURRIE, MA
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 1995, 6 (01) : 34 - 42
  • [34] Solder joint reliability with variations of solder ball land design
    Jung, Young Hy
    2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, : 389 - 409
  • [35] Stacked solder bumping technology for improved solder joint reliability
    Liu, XS
    Xu, SY
    Lu, GQ
    Dillard, DA
    MICROELECTRONICS RELIABILITY, 2001, 41 (12) : 1979 - 1992
  • [36] Solder joint qualification based on the wetting recognition in SMT laser soldering
    Liang, Xuwen
    Wang, Chunqing
    Jiang, Weiyan
    Qian, Yiyu
    Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering, 34 (05): : 106 - 110
  • [37] Mechanical strength analysis of SMT solder joint by finite element method
    Wang, Chunqing
    Wang, Ruijun
    Sang, Yan
    Qian, Yiyu
    China Welding, 1996, 5 (02):
  • [38] SMT solder joint's semi-experimental fatigue model
    Guo, Q
    Zhao, M
    Wang, HF
    MECHANICS RESEARCH COMMUNICATIONS, 2005, 32 (03) : 351 - 358
  • [39] Optimization of SMT Solder Joint Quality by Variation of Material and Reflow Parameters
    Wohlrabe, Heinz
    Herzog, Thomas
    Wolter, Klaus-Juergen
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1185 - 1191
  • [40] An Implementation of Health Prediction in SMT Solder Joint via Machine Learning
    Chang, Yi-Ming
    Wei, Chia-Chen
    Chen, Jeffrey
    Hsieh, Pack
    2019 IEEE INTERNATIONAL CONFERENCE ON BIG DATA AND SMART COMPUTING (BIGCOMP), 2019, : 185 - 188
12345